Cypress

CY62167EV30LL-45BVXI

CY62167EV30LL-45BVXI

Storage capacity: 16 Mbit

Organization: 2 M x 8/1 M x 16

Visit time: 45 ns

Maximum clock frequency:-

Interface type: Parallel

Power supply voltage-maximum: 3.6 V

Power supply voltage-minimum: 2.2 V

Supply current—maximum: 30 mA

Minimum working temperature:-40 C

Maximum operating temperature: + 85 C

Subcategory: Memory & Data Storage

Type: Asynchronous

Unit weight: 223.200 mg

Description

Features

■ TSOP I package configurable as 1M × 16 or 2M × 8 SRAM

■ Very high speed: 45 ns

■ Temperature ranges

❐ Industrial: –40 °C to +85 °C

■ Wide voltage range: 2.20 V to 3.60 V

■ Ultra-low standby power

❐ Typical standby current: 1.5 A

❐ Maximum standby current: 12 A

■ Ultra-low active power

❐ Typical active current: 7 mA at f = 1 MHz

■ Easy memory expansion with CE1, CE2, and OE Features

■ Automatic power-down when deselected

■ CMOS for optimum speed and power

■ Offered in Pb-free 48-ball VFBGA and 48-pin TSOP I packages

Functional Description

The CY62167EV30 is a high-performance CMOS static RAM

organized as 1M words by 16 bits or 2M words by 8 bits. This

device features an advanced circuit design that provides an ultra

low active current. Ultra low active current is ideal for providing

More Battery Life (MoBL®) in portable applications such as

cellular telephones. The device also has an automatic power

down feature that reduces power consumption by 99 percent

when addresses are not toggling. Place the device in standby

mode when deselected (CE1 HIGH or CE2 LOW or both BHE and

BLE are HIGH). The input and output pins (I/O0 through I/O15)

are placed in a high-impedance state when: the device is

deselected (CE1 HIGH or CE2 LOW), outputs are disabled (OE

HIGH), both Byte High Enable and Byte Low Enable are disabled

(BHE, BLE HIGH), or a write operation is in progress (CE1 LOW,

CE2 HIGH and WE LOW).

To write to the device, take Chip Enables (CE1 LOW and CE2

HIGH) and Write Enable (WE) input LOW. If Byte Low Enable

(BLE) is LOW, then data from I/O pins (I/O0 through I/O7) is

written into the location specified on the address pins (A0 through

A19). If Byte High Enable (BHE) is LOW, then data from the I/O

pins (I/O8 through I/O15) is written into the location specified on

the address pins (A0 through A19).

To read from the device, take Chip Enables (CE1 LOW and CE2

HIGH) and Output Enable (OE) LOW while forcing the Write

Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data

from the memory location specified by the address pins appears

on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from

memory appears on I/O8 to I/O15. See Truth Table on page 13

for a complete description of read and write modes.

For a complete list of related documentation, click here.

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